Mechatronica JSC is proud to announce that our CEO, Mr. Hinkov, recently took the global stage as a featured lecturer at RESPack 2026 in India.

As one of the world’s premier international conferences dedicated to packaging technology and innovation, RESPack serves as a vital hub for industry breakthroughs and future-forward concepts.

During the event, Mr. Hinkov represented Mechatronica among a prestigious gathering of global industry leaders, experts, and researchers. His participation offered a fantastic opportunity to exchange technical knowledge, discuss the evolution of packaging automation, and showcase our latest advancements to an international audience.

We extend our sincere thanks to the RESPack International Conference organizers for the invitation and for hosting such an impactful event. Mechatronica remains committed to driving innovation and shaping the future of global packaging technology.

To learn more about our advanced packaging solutions, explore our products page or get in touch with our team today.